Omschrijving
AP3 BGA265-1 STM32H-1
60-73-6062
specialized programming module for STMicroelectronics STM32H753XIH devices in TFBGA240+25 package,14x14 mm, 0.8 mm pitch, fine pitch ball grid array package
used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operating (mechanical) warranty of ZIF socket - 10,000 actuations
supported from PG4UW software version 3.69g
made in Slovakia
used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operating (mechanical) warranty of ZIF socket - 10,000 actuations
supported from PG4UW software version 3.69g
made in Slovakia