Omschrijving
AP3 BGA63-2.12 NAND-1
60-73-3167
specialized programming module for NAND flash devices in BGA63 package 13x10.5x max 1.2 mm, pitch 0.8mm, grid 12x10
used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operating (mechanical) warranty of ZIF socket – 10,000 actuations
supported from PG4UW software version 3.09
Merk: Elnec
used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operating (mechanical) warranty of ZIF socket – 10,000 actuations
supported from PG4UW software version 3.09
Merk: Elnec